Mechanics of Solder Alloy Interconnects
Darrel R. Frear; Steven N. Burchett; Harold S. Morgan; John H. Lau
Van Nostrand Reinhold Inc.,U.S.
1994
sidottu
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.