Hong Liang

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology. As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Das Buch handelt von der Dostojewski-Rezeption im frÃ"hen Werk von Karl Barth und Eduard Thurneysen, welche sich in drei wesentliche Phasen gliedern lässt: 1915 bis FrÃ"hjahr 1919, Spätjahr 1919 bis 1921 und 1922 bis 1923. In der ersten Phase betrachtet Barth im Zusammenhang seiner Auseinandersetzungen mit dem russischen Bolschewismus Dostojewskis Romane als ideale Verkörperung der extremen russischen Mentalität. Ab dem Spätjahr 1919 entwickeln er und Thurneysen gemeinsam eine neue Lesart, die sie vom Denkschema "Dostojewski-Russland" befreit: Dostojewski stelle das menschliche Leben als Leben unter Gericht und Gnade Gottes dar. Die Rekonstruktion der zweiten Phase konzentriert sich auf die Entstehung dieser theologischen Lebensthematik, die der Parallelität zwischen Barths Römerbriefkommentar (1922) und Thurneysens Dostojewski-Studie (1921) zugrunde liegt. In der dritten Phase hat sich diese lebenstheologische Lesart beider Theologen weiter entwickelt und verfestigt. Das Buch zielt darauf, die Eschatologie des Römerbriefkommentars mithilfe von Barths und Thurneysens Dostojewski-Rezeption aufs neue darzustellen. Es zeigt sich, dass der berÃ"hmte Anspruch "Gott ist Gott" im Römerbriefkommentar nicht nur die Transzendenz Gottes, sondern v. a. dessen Treue sowie "jenseitige Sinngebung" (Barth) des menschlichen Lebens bedeutet.

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology. As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.