Hua Lu

The aim of this book is to provide readers with an in-depth understanding of current state-of-the-art in the use of co-design and modeling tools to predict reliability and robustness of advanced packaging and integration technologies for both micro and power electronic systems. Authored by world leading experts in the field the of multiphysics/multi-domain modeling, the book starts with an overview of advanced packaging and integration technologies which details the manufacturing and reliability challenges that need to be addressed in the development of, for example, 3D-IC, novel bumping technologies such a copper column, lead-free solders and nano-sintering, and packaging technologies such as wafer level packaging. The book then progresses to discuss state-of-the-art modeling tools and techniques and the evolving progression towards co-design, and multi-domain analysis to ensure reliability and robustness. Finally a number of chapters demonstrate the application of these modeling methodologies and toolsets to advanced packaging and integration technologies.