Kirjojen hintavertailu – 12 859 829 kirjaa ja 27 kauppaa

Kirjailija

Shen Liu

Kirjat ja teokset yhdessä paikassa: 9 kirjaa, julkaisuja vuosilta 2011–2025, suosituimpiin kuuluu Dykes mafiques du Crétacé inférieur dans la faille centrale de Tancheng-Lujiang. Vertaile teosten hintoja ja tarkista saatavuus suomalaisista kirjakaupoista.

9 kirjaa

Kirjojen julkaisuvuodet: 2011–2025.

Freeform Optics for LED Packages and Applications

Freeform Optics for LED Packages and Applications

Kai Wang; Shen Liu; Xiaobing Luo; Dan Wu

John Wiley Sons Inc
2017
sidottu
A practical introduction to state-of-the-art freeform optics design for LED packages and applications By affording designers the freedom to create complex, aspherical optical surfaces with minimal or no aberrations, freeform design transcends the constraints imposed by hundreds of years of optics design and fabrication. Combining unprecedented design freedom with precise light irradiation control, freeform optics design is also revolutionizing the design and manufacture of high quality LED lighting. The first and only book of its kind, Freeform Optics for LED Packages and Applications helps put readers at the forefront of the freeform optics revolution. Designed to function as both an authoritative review of the current state of the industry and a practical introduction to advanced optical design for LED lighting, this book makes learning and mastering freeform optics skills simpler and easier than ever before with: Real-world examples and case studies systematically describing an array of algorithms and designs—from new freeform algorithms to design methods to advanced optical designsCoding for all freeform optics algorithms covered—makes it easier and more convenient to start developing points of freeform optics and construct lenses or reflectors, right awayCase studies of a range of products, including designs for a freeform optics LED bulb, an LED spotlight, LED street lights, an LED BLU, and many more Freeform Optics for LED Packages and Applications is must-reading for optical design engineers and LED researchers, as well as advanced-level students with an interest in LED lighting. It is also an indispensable working resource design practitioners within the LED lighting industry.
Computational and Statistical Methods for Analysing Big Data with Applications

Computational and Statistical Methods for Analysing Big Data with Applications

Shen Liu; James Mcgree; Zongyuan Ge; Yang Xie

Academic Press Inc
2015
sidottu
Due to the scale and complexity of data sets currently being collected in areas such as health, transportation, environmental science, engineering, information technology, business and finance, modern quantitative analysts are seeking improved and appropriate computational and statistical methods to explore, model and draw inferences from big data. This book aims to introduce suitable approaches for such endeavours, providing applications and case studies for the purpose of demonstration. Computational and Statistical Methods for Analysing Big Data with Applications starts with an overview of the era of big data. It then goes onto explain the computational and statistical methods which have been commonly applied in the big data revolution. For each of these methods, an example is provided as a guide to its application. Five case studies are presented next, focusing on computer vision with massive training data, spatial data analysis, advanced experimental design methods for big data, big data in clinical medicine, and analysing data collected from mobile devices, respectively. The book concludes with some final thoughts and suggested areas for future research in big data.
Modeling and Simulation for Microelectronic Packaging Assembly
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
LED Packaging for Lighting Applications

LED Packaging for Lighting Applications

Shen Liu; Xiaobing Luo

John Wiley Sons Inc
2011
sidottu
Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products. One of the only books to cover LEDs from package design to manufacturing to testingFocuses on the design of LED packaging and its applications such as road lightsIncludes design methods and experiences necessary for LED engineers, especially optical and thermal designIntroduces novel LED packaging structures and manufacturing processes, such as ASLPCovers reliability considerations, the most challenging problem for the LED industryProvides measurement and testing standards, which are critical for LED development, for both LED and LED fixturesCodes and demonstrations available from the book’s Companion Website This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production. Color version of selected figures can be found at www.wiley.com/go/liu/led