Sujoy Kumar Saha

This Brief deals with externally finned tubes, their geometric parameters, Reynolds number, dimensionless variables, friction factor, plain plate fins on round tubes, the effect of fin spacing, correlations, pain individually finned tubes, circular fins with staggered tubes, low integral fin tubes, wavy fin, enhanced plate fin geometries with round tubes, Offset Strip Fins, convex louver fins, louvered fin, perforated fin, mesh fin, vortex generator, enhanced circular fin geometries, spine or segmented fin, wire loop fin, flat extruded tubes with internal membranes, plate and fin automotive radiators, performance comparison, numerical simulation, advanced fin geometries, hydrophilic coatings, internally finned tubes and annuli, spirally fluted and indented tube, advanced internal fin geometries, and finned annuli. The book is ideal for professionals and researchers dealing with thermal management in devices.

This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.

This Brief concerns heat transfer and pressure drop in heat transfer enhancement for boiling and condensation. The authors divide their topic into six areas: abrasive treatment and coatings, combined structured and porous surfaces, basic principles of boiling mechanism, vapor space condensation, convective vaporization, and forced condensation inside tubes. Within this framework, the book examines range of specific phenomena including abrasive treatment, open grooves, 3D cavities, etched surfaces, electroplating, pierced 3D cover sheets, attached wire and screen promoters, non-wetting coatings, oxide and ceramic coatings, porous surfaces, structured surfaces (integral roughness), combined structured and porous surfaces, composite surfaces, single-tube pool boiling tests, theoretical fundamentals like liquid superheat, effect of cavity shape and contact angle on superheat, entrapment of vapor in cavities, nucleation at a surface cavity, effect of dissolved gases, bubble departure diameter, bubble dynamics, boiling hysteresis and orientation effects, basic principles of boiling mechanism, visualization and mechanism of boiling in subsurface tunnels, and Chien and Webb parametric boiling studies.

This Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices.

This Brief stands as a primer for heat transfer fundamentals in heat transfer enhancement devices, the definition of heat transfer area, passive and active enhancement techniques and their potential and benefits and commercial applications. It further examines techniques and modes of heat transfer like single-phase flow and two-phase flow, natural and forced convection, radiation heat transfer and convective mass transfer.

This Brief deals with Performance Evaluation Criteria (PEC) for heat exchangers, single phase flow, objective function and constraints, algebraic formulation, constant flow rate, fixed flow area, thermal resistance, heat exchanger effectiveness, relations for St and f, finned tube banks, variations of PEC, reduced exchanger flow rate, exergy based PEC, PEC for two-phase heat exchangers, work consuming, work producing and heat actuated systems. The authors explain Performance Criteria of Enhanced Heat Transfer Surfaces—the ratio of enhanced performance to the basic performance—and its importance for Heat Transfer Enhancement and efficient thermal management in devices.

This Brief deals with heat transfer and friction in plate and fin extended heat transfer enhancement surfaces. It examines Offset-Strip Fin (OSF), Enhancement Principle, Analytically Based Models for j and f vs. Re, Transition from Laminar to Turbulent Region, Correlations for j and f vs. Re, Use of OSF with Liquids, Effect of Percent Fin Offset, Effect of Burred Edges, Louver fin, heat transfer and friction correlations, flow structure in the louver fin array, analytical model for heat transfer and friction, convex louver fin, wavy fin, 3D corrugated fin, perforated fin, pin fins and wire mesh, types of vortex generators, metal foam fin, plain fin, packings, numerical simulation of various types of fins.

This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis.

This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Microchannels,” and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,” by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.