Kirjojen hintavertailu – 12 903 724 kirjaa ja 27 kauppaa

Kirjailija

Yongqiang Yang

Kirjat ja teokset yhdessä paikassa: 2 kirjaa, julkaisuja vuosilta 2023–2024, suosituimpiin kuuluu Laser Powder Bed Fusion of Additive Manufacturing Technology. Vertaile teosten hintoja ja tarkista saatavuus suomalaisista kirjakaupoista.

2 kirjaa

Kirjojen julkaisuvuodet: 2023–2024.

Laser Powder Bed Fusion of Additive Manufacturing Technology

Laser Powder Bed Fusion of Additive Manufacturing Technology

Di Wang; Yongqiang Yang; Yang Liu; Yuchao Bai; Chaolin Tan

SPRINGER VERLAG, SINGAPORE
2024
nidottu
This book systematically introduces the powder bed laser melting technology and its application and summarizes the author's team's experience in scientific research, engineering development, and data accumulation in recent 15 years. It includes in-depth theoretical analysis and a lot of engineering experience in equipment debugging, process development, and material testing. The book takes the powder bed laser melting technology as the object and divides the content into 15 chapters. It is used as technical learning materials for researchers and engineering development personnel engaged in metal 3D printing.
Laser Powder Bed Fusion of Additive Manufacturing Technology

Laser Powder Bed Fusion of Additive Manufacturing Technology

Di Wang; Yongqiang Yang; Yang Liu; Yuchao Bai; Chaolin Tan

SPRINGER VERLAG, SINGAPORE
2023
sidottu
This book systematically introduces the powder bed laser melting technology and its application and summarizes the author's team's experience in scientific research, engineering development, and data accumulation in recent 15 years. It includes in-depth theoretical analysis and a lot of engineering experience in equipment debugging, process development, and material testing. The book takes the powder bed laser melting technology as the object and divides the content into 15 chapters. It is used as technical learning materials for researchers and engineering development personnel engaged in metal 3D printing.